Chemical Vapor Deposition

 

Description: Layering and deposition techniques, equipment, measurements, materials, and processes.

Length of time: 6

Prerequisites:

Module: Ion Implant -

Topics:

1. Desirable attributes of films

Flatness

Thickness

Uniformity

Stress-free

Purity

2. Chemical vapor deposition systems (AP, LP, & PE)

Chemistry

Equipment

Materials

Methods

Measurements

Processes

3. Types of film

Semiconductor

Insulator (dielectric)

Conductor

4. Depositions

Epitaxial

Polysilicon

Qualities

Applications

Student objectives:

Student will be able to:

1. List at least five desirable attributes of deposited films. Explain why they are important in the manufacture of semiconductor devices.

2. Name the main parts of a CVD system. Use sketches as necessary.

3. Explain the basic principles of CVD and discuss the related chemical considerations.

4. Give major similarities and differences in methods, materials, and equipment across APCPD, LPCVD, and PECPD systems.

5. Discuss deposited films and electronic functions they can provide within the manufactured microcircuitry.

6. Define and explain conditions necessary for "epitaxial silicon growth" and "polysilicon" film deposition. Give applications for each type of film.

7. Give a brief overview of processes used to provide epitaxial and polysilicon semiconductor layers, insulators (dielectrics), and conductors in microelectronic devices.

8. Identify key measurements and adjustments necessary to support the proper control and operation of layering/deposition processes.