Description: Classes and sources of contamination; methods, systems, equipment, and apparatus used to protect against contaminants; and electrostatic discharge protection in semiconductor manufacturing process. Includes cleanroom protocol. Useful for preparing students for cleanroom certification.
Length of time: 6 hrs.
Module: Overview and History of Semiconductor Manufacturing Process
1. Classes of contamination
2. Sources of contamination
3. Methods of protection
4. Contamination control in water, gases, and chemicals
5. Air contamination control
6. Equipment issues (source and safeguard)
7. Measurement of "cleanliness."
Student will be able to:
1. Explain the high costs due to improper application of contamination control techniques (CCT) in semiconductor manufacturing process environments.
2. Show how proper, effective contamination control techniques can increase quality and productivity of semiconductor products.
3. List the four major classes of contamination to which semiconductor devices are vulnerable.
4. List at least six major contamination sources in semiconductor manufacturing process.
5. Describe methods and equipment or apparatus used to guard against six major contamination sources in semiconductor manufacturing process.
6. Describe hazards of electrostatic discharge and how these hazards are controlled in semiconductor manufacturing process.
7. Provide some reasonable, yet adequate, specifications for process water, gases, chemicals, and static electricity in semiconductor manufacturing process.
8. Sketch a cleanroom and explain its features with regard for construction materials, layout, floor mats, gowning area, air pressures, air showers, service bays, double-door pass throughs, and static control.
9. Explain "class number" as defined in Federal Standard 209B in the context of particle size. List class numbers by location in a variety of locations in and about the semiconductor manufacturing process environment.
10. Explain how and why clean-room personnel guard against contamination and electrostatic discharge hazards to semiconductor devices.
11. Explain major strategies and equipment used to provide "clean air" in the semiconductor manufacturing process facility.
12. Describe cleanroom protocol and give reasons for all elements of the protocol.
13. Explain how cleanliness can be measured. Focus on a wide variety of contaminants.