Description: Show the wafer surface for a variety of electronic components including fuses, resistors, capacitors, diodes, bipolar junction transistors, JFETs, MOSFETs, CMOS, and other microelectronic devices. Includes isolation techniques.
Length of time: 9 hrs.
Module: Overview & History of Semiconductor Manufacturing Process
1. Passive devices
2. Active devices
Bipolar junction transistors
3. Isolation techniques
4. Functions provided by semiconductor devices
Logic (and, or , nor, nand, invert etc.)
Student will be able to:
1. Explain key functions of conductors, insulators, resistors, fusible links, diodes, and capacitors in microelectronic circuits. Show how they are achieved in semiconductor manufacturing.
2. Discuss ways to control resistance, capacitance, and inductance in the manufacture of microelectronic circuits.
3. Using sketches, compare a P/N planar diode with a Schottky barrier diode. Compare and contrast properties of these types of diode.
4. Name the key parts and functions of bipolar transistors, JFETs, MOSFETs, and CMOS transistors. Use sketches to show these devices in the finished semiconductor product.
5. List various types of MOS gate structures. Compare and contrast advantages.
6. Explain at least four isolation techniques or schemes used to provide isolation in semiconductor devices. Show basic process flows where feasible.
7. List major electrothermal properties of bipolar, JFET, MOSFET, CMOS, and BiCMOS devices. Give a typical electronic application for each.
8. Describe some commercially available computer components or functions provided by microelectronic devices (e.g. logic, memory, light emission).