Microelectronic Devices

 

Description: Show the wafer surface for a variety of electronic components including fuses, resistors, capacitors, diodes, bipolar junction transistors, JFETs, MOSFETs, CMOS, and other microelectronic devices. Includes isolation techniques.

Length of time: 9 hrs.

Prerequisites:

Generic electronics

Module: Overview & History of Semiconductor Manufacturing Process

Topics:

1. Passive devices

Conductors

Insulators

Resistors

Capacitors

Inductors

Diodes

Fusible links

2. Active devices

Bipolar junction transistors

JFETs

MOSFETs

CMOS

BiCMOS

3. Isolation techniques

Junction

Dielectric

Isoplanar

Trench

4. Functions provided by semiconductor devices

Logic (and, or , nor, nand, invert etc.)

5. Memory

 

Student objectives:

Student will be able to:

1. Explain key functions of conductors, insulators, resistors, fusible links, diodes, and capacitors in microelectronic circuits. Show how they are achieved in semiconductor manufacturing.

2. Discuss ways to control resistance, capacitance, and inductance in the manufacture of microelectronic circuits.

3. Using sketches, compare a P/N planar diode with a Schottky barrier diode. Compare and contrast properties of these types of diode.

4. Name the key parts and functions of bipolar transistors, JFETs, MOSFETs, and CMOS transistors. Use sketches to show these devices in the finished semiconductor product.

5. List various types of MOS gate structures. Compare and contrast advantages.

6. Explain at least four isolation techniques or schemes used to provide isolation in semiconductor devices. Show basic process flows where feasible.

7. List major electrothermal properties of bipolar, JFET, MOSFET, CMOS, and BiCMOS devices. Give a typical electronic application for each.

8. Describe some commercially available computer components or functions provided by microelectronic devices (e.g. logic, memory, light emission).