Semiconductor Processing Measurements


Description: Mechanical, fluidic, electrical, chemical, thermal, optical, and general environmental measurement techniques and equipment in semiconductor manufacturing process. Includes basic metrology, typical units, and prefixes.

Length of time: 3 hours


Module: Microelectronic Devices

Module: Process Flow


1. Typical units of measurements and prefixes used in semiconductor manufacturing process assembly and test.

2. Precision and accuracy.

3. Measurement categories

Electrical (e.g. voltage, current, resistance, power)

Fluidic (e.g. pressure, vacuum, and flow)

Mechanical (e.g. depth, thickness, breaking strength)

Thermal (e.g. temperature)

Optical (e.g. intensity, resolution, opacity)

4. Measurement equipment

5. Calibration


Student objectives:

Student will be able to:

  1. List typical units of measurement and prefixes common to measurements in semiconductor manufacturing process.
  2. Explain the difference between accuracy and precision in metrology. Give an example from semiconductor manufacturing process.
  3. Demonstrate or describe some key electrical, fluidic, mechanical, thermal, and optical measurements and the related measurement methods and instruments used in semiconductor manufacturing process operations.
  4. List equipment that requires periodic measurements in semiconductor manufacturing process facilities. How often must these measurements be taken?
  5. Identify meters and gauges on equipment and devices used in semiconductor manufacturing process. Explain what is being measured.
  6. Describe some calibration procedures that support sufficiently accurate, precise measurements in semiconductor manufacturing process equipment and operations.