The @MATEC Archives

Volume 1, Number3 1998 ATESM Plenary Session on IBM’s Research into Copper Interconnect
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Dr. Daniel C. Edelstein

IBM, T. J. Watson Research Center

Dr. Edelstein is a Research Staff Member at IBM’s T.J. Watson Research Center in Yorktown Heights, New York. He received his B.S., M.S. and Ph.D. degrees in Applied Physics from Cornell University in 1982, 1986 and 1990, respectively. His thesis involved the invention of new femtosecond lasers and their use for ultrafast measurements in semiconductors. At IBM, he has worked on advanced interconnect technologies for silicon IC chips. This has spanned the range of interconnect issues, from process integration, advanced materials and reliability, to performance modeling, interconnect scaling and dielectric and high-speed measurements. In general, these have been applied to the research and development of copper interconnects for IBM’s ULSI CMOS programs, for which Dr. Edelstein has played a leadership role. The culmination of this work, which was the subject of recent worldwide press, has come to be referred to as IBM;s "copper chip" technology.