Chemical Mechanical Planarization

Self-Check / Assessment

 

1. The purpose of the planarization process in the FAB is to:

a. prepare bare silicon wafers that have been cut from crystal ingots.

b. prevent build up of surface features ("topography").

c. allow more levels of interconnect wiring.

d. allow reduction in chip dimensions and feature sizes.

e. all of the above.

 

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